This article describes how to solder a quad flat pack component to a printed circuit board. The details of the process are covered, including chip placement, bent pin recovery, tacking, the soldering and solder bridge removal.
Get a hypodermic needle and a fine pair of pliers. Make a small 90 degree bend on the tip of the hypodermic needle. The bend acts as a kind of hook or puller Custom face mask for the bent pin legs.
You will need a good place to apply the spray paint. Hopefully you have a room with good ventilation. However, you don’t want to be in an area where there is a breeze and dust is blowing around.
A stencil made from a thin material (like paper) doesn’t have an edge thick enough to block the paint as it is sprayed. So the edges should be crisp even if you are not holding the can at an exact 90 degree angle from the surface. However, a thin material (like paper) might be flimsy allowing paint to get under the edges if it curls or gets blown by the spray. If you are using paper, you may want to consider an adhesive backing option as described above to keep this from happening.
Most workshop safety issues really aren’t from an accident with a power tool, rather they are little things that accumulate over time that involve your eyes, your hearing, and your breathing.
And you’ll need stencils – hence the spray paint stencils part! The variety of stencils available to you is mind numbing. So, it’s next to impossible for me to recommend any one kind of stencil because I don’t know anything about your project. My best advice is to experiment and test different stencils and materials.
Let the paint dry thoroughly before lifting the stencil. Removing a wet stencil can cause smudging. Try to pull the stencil straight up or hold down at one end and roll it up carefully from the other end. The idea is to avoid dragging the stencil over a wet surface.
That completes the description of the quad flat pack soldering process, including chip placement, bent pin recovery, tacking, the soldering and solder bridge removal.